“There was panic buying of wire bonders in 2021. All of this impacts the delivery schedules of many package types. So far in 2022, the situation is improving, but it’s still an issue. Last August, delivery lead times for many wire bonder types spiked and were hovering around 10 months. So many packaging houses want more wire bonders to meet demand. For some time, many packaging houses have been sold out of wirebonding capacity amid huge demand in the arena. Nonetheless, in wirebonding, packaging customers face important new challenges. Wirebonding is completely different than copper hybrid bonding, which is a far more advanced and costly technology used for die stacking, packaging, and other applications. In response, wire bonder vendors have developed faster systems, including those with AI-enabled defect detection and factory automation capabilities. ![]() ![]() ![]() Over the years, customers have demanded faster and more capable wire bonders. Still, packaging houses have multitudes of these key tools that help assemble many - but not all - package types. ![]() Wirebonding is an older technology that typically flies under the radar. The wire bonder market doubled last year, alongside advanced packaging’s rise. A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages.
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